1millionfortunesmegaways| Glass substrate: Samsung is expected to start mass production of glass substrate packaging technology in 2026 and Intel in 2027

Source Gangtise Investment Research

analysts said1millionfortunesmegawaysGlass substrate packaging has advantages such as thermal stability, high pass hole density and thin and light design1millionfortunesmegaways, suitable for artificial intelligence chips. Investment opportunities are likely to be concentrated in the equipment and materials sector, especially the growing demand for precision equipment and new materials. It is expected that Samsung will start mass production of glass substrate packaging technology in 2026 and Intel will start mass production in 2027. Experts say Samsung is expected to make progress in glass substrate technology faster than Intel because its uses are clearer and Intel needs to meet higher standards. Domestic glass substrates have made major breakthroughs in the application of companies such as Huawei and Xiaomi.